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浙江中科镭特电子有限公司

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Laser invisible scribing system

LTUF200 is a multifunctional and intelligent wafer laser automatic cutting system. The multi-function is reflected in the cutting of sapphire, SiC, SiO Ψ, Si and high hardness and high brittleness materials. Intellectualization is reflected in this system, which is equipped with CCD image positioning system, automatic focusing system, follow-up system, automatic loading and unloading system and conventional application database automatic call system.
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1、 Highly reliable mass production system

Vibration resistant marble platform support structure
Low maintenance cost laser
Unique laser surface cutting technology
Automatic loading and unloading system
High precision and long-life motion platform
CCD positioning system makes machining intelligent
Precision ceramic microporous sucker
The automatic focusing system ensures the focus position of processing
Scientific structure ensures processing stability
Friendly user interface and powerful software

2、 Technical features

High performance laser

Special laser, good beam quality, small focusing light shift and high cutting quality.
Ultra high cutting accuracy

High precision imported linear motor motion system, the cutting accuracy is controlled at the micron level.
Fully automatic positioning

Machine vision grabs mark points for positioning, with high accuracy, no manual intervention, simple operation and high efficiency.
Convenient processing of drawings and files

Cutting drawing files can be used only by using AutoCAD and other processing.
Marble structure

The full marble frame structure and shock absorption isolation design can ensure the stability of the light path under high-speed movement.
Laser protection system

The laser protection structure in line with industrial standards ensures the safety of operators.

 

 

Keyword:
Laser Invisible Scribing System
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Automatic wafer laser cutting system
Wafer scale  ≤ φ8" φ8"~φ12"
X/Y Axis machining range(mm 210 310
X/Y Axis travel speed(mm/sec Maximum speed 1000
X/Y Axis resolution(μm 0.1
X/Y Axis repeated positioning accuracy(μm Full travel±1
Axis machining range(mm 15
Z Axis resolution(μm 0.1
Z Axis repeated positioning accuracy(μm ±1
θ axis rotation range(°) ±190
θ Axis resolution(°) 0.0005
Complete machine power(kW)  6.5 9
Complete machine weight(kg) 2700
Complete machine size(mm)  L2500 x W1500 x H2000

 

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Contact: Yang Ying

Add:No. 218, Huaxi Road, Qiubin Street, Wucheng District, Jinhua City, Zhejiang Province

TEL:400-990-7528

E-mail :sales@zklt-tech.com

Fax:0579-82166682

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