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浙江中科镭特电子有限公司

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Wafer Laser Annealing System

LT200A is an intelligent wafer laser annealing system. It is mainly used in the heat treatment process of wafers, including wafer alloying, injection annealing and doping activation. Intellectualization is reflected in this system, which is equipped with image positioning system, automatic focusing system, intelligent temperature detection, automatic loading and unloading system and automatic database call system for conventional applications.
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 Technical features

High performance laser

Laser, good beam quality, good stability, high single pulse energy.
Optimized optical system

Beam shaping and customized flat top facula improve the consistency of annealing temperature and processing efficiency.
Fully automatic execution

Machine vision positioning, high accuracy, no manual intervention, simple operation and high efficiency.
Laser protection system

The laser protection structure in line with industrial standards ensures the safety of operators.

 

Keyword:
Wafer Laser Annealing System
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Wafer laser annealing system LT200A

 

Wafer scale 

≤ φ8"

X/Y Axis machining range(mm

210

X/Y Axis travel speed(mm/sec

Maximum speed 1000

X/Y Axis resolution(μm

0.1

X/Y Axis repeated positioning accuracy(μm

Full travel±1

Z Axis machining range(mm

15

Z Axis resolution(μm

0.1

Z Axis repeated positioning accuracy(μm

±1

Processing galvanometer system

Digital high precision galvanometer

Fastest processing speed(mm/sec

6000

Setting accuracy on work(μm) 

1

Laser device  Multi-wavelength laser

Beam quality

flat roof

Beam shape

square

Complete machine power(kW)

6.5

Complete machine weight(kg) 

1500

Complete machine size(mm) 

L1300 x W1900 x H1850

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Unified national service hotline

400-990-7528

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Contact: Yang Ying

Add:No. 218, Huaxi Road, Qiubin Street, Wucheng District, Jinhua City, Zhejiang Province

TEL:400-990-7528

E-mail :sales@zklt-tech.com

Fax:0579-82166682

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