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Laser wafer grooving system

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LTUF300S is a multifunctional and intelligent wafer laser automatic cutting system. The multi-function is reflected in the wafer cutting that can be used for a variety of surface materials such as low-k, WLP, etc. Intellectualization is reflected in this system, which is equipped with CCD image positioning system, automatic calibration system, follow-up system, full-automatic loading and unloading system and conventional application database automatic call system.

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TEL: 400-990-7528
E-mail: sales@zklt-tech.com

Product description

Parameters

Technical parameter

1、 Highly reliable mass production system

◆ Vibration resistant marble platform support structure
◆ Femtosecond laser with low maintenance cost
◆ Unique laser surface cutting technology
◆ Automatic loading and unloading system
◆ High precision and long-life motion platform
◆ CCD positioning system makes machining intelligent
◆ Precision ceramic microporous sucker
◆ The automatic focusing system ensures the focus position of processing
◆ Scientific structure ensures processing stability
◆ Friendly user interface and powerful software

2、 Technical features

High performance laser Imported femtosecond laser, with good beam quality, small focusing light shift and high cutting quality.	Ultra high cutting accuracy High precision imported linear motor motion system, the cutting accuracy is controlled at the micron level.
Fully automatic positioning Machine vision grabs mark points for positioning, with high accuracy, no manual intervention, simple operation and high efficiency.	Convenient processing of drawings and files Cutting drawing files can be used only by using AutoCAD and other processing.
Marble structure Full marble frame structure, shock absorption and isolation design, ensuring the stability of the light path and high-speed movement.	Laser protection system The laser protection structure in line with industrial standards ensures the safety of operators.

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Laser Wafer Grooving System

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400-990-7528

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Contact: Yang Ying

Add:No. 218, Huaxi Road, Qiubin Street, Wucheng District, Jinhua City, Zhejiang Province

TEL:400-990-7528

E-mail :sales@zklt-tech.com

Fax:0579-82166682

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2022 Zhejiang Zhongke Laite Electronics Co., Ltd. 浙ICP备2021039386号-1 Powered by www.300.cn seo

Wafer laser automatic cutting system LTUF300S
Wafer scale	≤ φ12"
X/Y axis machining range (mm)	310
X/Y Axis travel speed（mm/sec）	Maximum speed 1000
X/Y Axis resolution（μm）	0.1
X/Y Axis repeated positioning accuracy（μm）	Full travel±1
Z-axis machining range(mm)	15
Z Axis resolution（μm）	0.1
Z Axis repeated positioning accuracy（μm）	±1
Processing galvanometer systemProcessing galvanometer system	Digital high precision galvanometer
Fastest processing speed（mm/sec）	6000
Setting accuracy on work(μm)	1
Laser device	femtosecond
laser power	More than 15
Laser frequency	More than 1
θ axis rotation range(°)	±190
θ Axis resolution（°）	0.0005
Complete machine power(kW)	6.5
Complete machine weight(kg)	2950
Complete machine size(mm)	L 2500 x W 1500 x H 1900

浙江中科镭特电子有限公司

Laser wafer grooving system