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Development history

2019

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Time of issue:2022-07-01 18:01
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(Summary description)Mass production of SiC based laser annealing
Mass production of silicon carbide based laser dicing
Mass production of composite laser scribing
Join the China integrated circuit industry alliance

2019

Categories:Development history
Author:
Origin:
Time of issue:2022-07-01 18:01
Views:0

Information

Mass production of SiC based laser annealing
Mass production of silicon carbide based laser dicing
Mass production of composite laser scribing
Join the China integrated circuit industry alliance

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Previous: 2021

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07-01 

2021

Round slicing mass production Zhejiang Zhongke radium Technology Co., Ltd. was established

07-01 

2019

Mass production of SiC based laser annealing Mass production of silicon carbide based laser dicing Mass production of composite laser scribing Join the China integrated circuit industry alliance

07-01 

2018

Mass production of SiC based laser annealing Mass production of silicon carbide based laser dicing Mass production of composite laser scribing Join the China integrated circuit industry alliance

07-01 

2016

Research and development of laser scribing Research and development of laser removal Silicon based laser annealing mass production Invisible cutting realizes the first sale

07-01 

2015

Laser welding mass production Research and development of silicon based laser annealing Invisible cutting research and development Obtain national high-tech certification

07-01 

2014

Passed ISO9001 quality system certification

07-01 

2013

Establishment of the company Research and development of laser welding

07-01 

Zhejiang Laser Technology and Applications., LTD. is fully launched, and is committed to becoming a leading enterprise in laser processing equipment manufacturing!

Lasermicronanoprocessingtechnologysolutions,andthesupplierofcompleteequipment.Ithas1500㎡cleanproductionworkshop,1500㎡electronicassemblyworkshopand1000㎡comprehensiveofficearea; ZhejiangLaserTechnologyandApplications.,LTD. wasofficiallyestablishedinMay2021.Atpresent,ithasbeenfullycompletedandputintoproduction.TheZhejiangCompany panoramaOfficebuilding Overlookingtheplantarea Asawholly-ownedsubsidiaryof BeijingLaserTechnologyandApplications.,LTD., TheZhejiangCompany ismainlyresponsibleforthemassproductionofafullsetofcoreequipmentforintegratedcircuitmanufacturingthat the BeijingCompany hascompleteditstechnologicalresearchanddevelopment.Thecompletionandoperationof ZhejiangCompany alsomarkstherealizationof Beijing Company “ hasmadeanewjourneyonthedevelopmentroadof“Integrationoflearning,researchandproduction” Listspecialworkshop TheZhejiangCompany isaprovideroflasermicronanoprocessingtechnologysolutionsandcompleteequipmentwiththeparticipationoftheInstituteofmicroelectronicsoftheChineseAcademyofSciences.Withyearsoftechnologyaccumulationandindustrializationdevelopmentinthefieldofkeyequipmentforchipmanufacturing,ithasbeenmassproduced“Laserslicing,laserannealing,laserremoval,laserwelding”Andaseriesofcoreequipmentinchipmanufacturing,packagingandtestingindustries.WithstrongR&Dcapabilitiesandyearsoftechnologyaccumulation,Thetechnologyof"optical,mechanical,electrical,software,processandcompletemachine"hasbeenattheleadinglevelinChina,andhasformedmorethan80intellectualpropertyrightssuchasinventionpatents. Oneofthemainproducts Theusersofourcompany.covermajordomesticindustriessuchasmainstreamwafermanufacturers,packagingandtestingmanufacturers,aerospace,and ChinaLightandPower.Sinceitsinception,ThecompanyimplementsR&Dandinnovationpath,withtheglobalgrowthofsemiconductorequipmentdemand,thecompanyisboundtofacenewdevelopmentopportunities.WithanefficientR&Dandmanagementteam,advancedmanagementconceptandperfectmanagementsystem, Thecompany alwaysadherestothedevelopmentconceptof"coreteamleadsgrowth,independentR&Dachievesthefuture",pursuestheenterprisepurposeof"Innovation&development",accumulatesandstriveshardtocreateaChinesenationalbrandandbecomeahighgrowthenterprisewithsustainablemanagement,Wearecommittedtobecomingaleadingenterpriseinthemanufacturingoflaserprocessingequipmentinthefieldofglobalintegratedcircuitmanufacturing!

04-29 

200mm wafer fab capacity surges 21% to ease supply-demand imbalance

On April 11, 2022, California time, the "200mm Fab Outlook Report" released by SEMI shows that from the beginning of 2020 to the end of 2024, the production capacity of 200mm fabs will increase by 1.2 million pieces per month (increase 21%), reaching a record 6.9 million per month.

04-29 

Worldwide semiconductor equipment sales surge 44% in 2021 to hit industry high of $102.6 billion

SEMI proposed in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor manufacturing equipment sales will surge in 2021, compared with 2020 $71.2 billion rose 44% to an all-time high of $102.6 billion.