Packaging and testing is to cut, wire, and plastically package the produced qualified wafers, so that the chip circuit can be electrically connected to external devices, and provide mechanical and physical protection for the chip, and use the testing tools provided by integrated circuit design companies to complete the packaging. chip for functional and performance testing. The packaging and testing has the function of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, and it is also a bridge to communicate the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the packaging and testing shell with wires. It also establishes connections with other devices through wires on the printed board. Therefore, packaging and testing plays an important role in integrated circuits.