The main work of wafer manufacturing is to fabricate circuits and electronic components on silicon wafers. The basic processing steps are usually that the silicon wafer is properly cleaned first, then oxidized and deposited, and finally developed, etched and doping and other repeated process steps to complete the processing and fabrication of circuits on the silicon wafer to form a wafer.
The specific process is as follows:

(1) Surface cleaning;
(2) Primary oxidation;
(3) Heat treatment: Before coating the photoresist, coat the surface of the cleaned substrate with an adhesion enhancer or place the substrate in an inert gas for heat treatment. This treatment can increase the adhesion between the photoresist and the substrate, and prevent side etching during wet etching due to the peeling of the photoresist pattern during development.

(4) Apply photoresist;
(5) Photolithography;
(6) Doping;
(7) Transistor formation.